DocumentCode
3588963
Title
[Title pages]
fYear
2014
Abstract
The following topics are dealt with: power integrity techniques; high-speed channels and statistical analysis; TSVs and 3D interconnects; RF packages; signal integrity; 3D interconnect; and electromagnetics.
Keywords
electromagnetic fields; electronics packaging; integrated circuit interconnections; statistical analysis; three-dimensional integrated circuits; 3D interconnect; 3D interconnects; RF packages; TSVs; electromagnetics; high-speed channels; power integrity techniques; signal integrity; statistical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN
978-1-4799-3641-0
Type
conf
DOI
10.1109/EPEPS.2014.7103574
Filename
7103574
Link To Document