DocumentCode :
3588969
Title :
A study of split and common ground referencing schemes for a high speed bus
Author :
Tingdong Zhou ; Wenzel, Robert
Author_Institution :
Digital Networking Group, Freescale Semicond., Austin, TX, USA
fYear :
2014
Firstpage :
15
Lastpage :
18
Abstract :
Two different module referencing schemes, one with split ground planes between transmit/receive (TX/RX), and the other with a common ground plane, are first compared using models generated from 3D full-wave solver, and then the two different module designs are built and tested. The measurements performed and test data on the manufactured modules includes TX output high-low amplitude, eye height, RX jitter tolerance, Phase-Lock-Loop (PLL) interference, and jitter transfer function testing for the transmitter. The data indicates that the common ground referencing scheme results in superior performance for the high speed interface.
Keywords :
integrated circuit design; integrated circuit testing; system-on-chip; 3D full-wave solver; PLL; RX jitter tolerance; TX output high-low amplitude; common ground plane; common ground referencing schemes; eye height; high speed bus; high speed interface; jitter transfer function testing; module designs; module referencing schemes; phase-lock-loop interference; split ground planes; split ground referencing schemes; system-on-chip; transmitter; Clocks; Crosstalk; Frequency measurement; Jitter; Phase locked loops; Receivers; Transmitters; Crosstalk; Jitter; Phase-lock-loop (PLL); Serializer/Deserializer (SerDes); Signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
Type :
conf
DOI :
10.1109/EPEPS.2014.7103581
Filename :
7103581
Link To Document :
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