Title :
Advances in TSVs and 3D interconnects
Author :
Franzon, Paul ; Grivet-Talocia, Stefano
Author_Institution :
North Carolina State University, USA
Abstract :
A record of the panel discussion was not made available for publication as part of the conference proceedings.
Keywords :
Integrated circuit interconnections; Through-silicon vias;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103590
