• DocumentCode
    3588978
  • Title

    Advances in TSVs and 3D interconnects

  • Author

    Franzon, Paul ; Grivet-Talocia, Stefano

  • Author_Institution
    North Carolina State University, USA
  • fYear
    2014
  • Firstpage
    47
  • Lastpage
    48
  • Abstract
    A record of the panel discussion was not made available for publication as part of the conference proceedings.
  • Keywords
    Integrated circuit interconnections; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
  • Print_ISBN
    978-1-4799-3641-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2014.7103590
  • Filename
    7103590
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3588978