Title :
RF packages and interconnects
Author :
Gu, Kevin ; Martin, Wes
Author_Institution :
IBM, USA
Abstract :
A record of the panel discussion was not made available for publication as part of the conference proceedings.
Keywords :
Integrated circuit interconnections; Radio frequency;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103594
