Title :
Signal propogation in 3D interconnect
Author :
Kim, Joungho ; Asai, Hideki
Author_Institution :
KAIST, South Korea
Abstract :
A record of the panel discussion was not made available for publication as part of the conference proceedings.
Keywords :
Integrated circuit interconnections;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103612
