Title :
Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs
Author :
Jia-Yi Wu ; Mu-Shui Zhang ; Hong-Zhou Tan ; Yong-Xin Guo
Author_Institution :
Sch. of Inf. Sci. & Technol., Sun Yat-sen Univ., Guangzhou, China
Abstract :
In this paper, a substrate noise suppression method using P+ contact array and grid ground plane is proposed, which yield excellent noise suppression below -60 dB in extremely wide frequency range from DC up to 50 GHz. P+ contact array suppresses the low-frequency noise while the grid ground suppresses the high-frequency noise. Accurate circuit models are developed by simple extraction. The noise suppression performance of the proposed structure is compared with guard ring. Results show that our method yields excellent noise suppression performance.
Keywords :
integrated circuit modelling; integrated circuit noise; interference suppression; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; three-dimensional integrated circuits; 3D TSV IC; P+ contact array; RF IC; circuit models; frequency 50 GHz; grid ground plane; grid ground suppresses; high-frequency noise; low-frequency noise; mixed-signal IC; noise suppression; radiofrequency integrated circuits; substrate noise coupling isolation; Arrays; Couplings; Integrated circuit modeling; Noise; Substrates; Three-dimensional displays; Through-silicon vias; 3D-IC; Noise coupling suppression; guard ring;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103629
