• DocumentCode
    3589015
  • Title

    Minimizing differential crosstalk of vias for high-speed data transmission

  • Author

    Aihara, Kunia ; Buan, Jeremy ; Nagao, Adam ; Takada, Toshiyuki ; Ching-Chao Huang

  • Author_Institution
    High-speed Interconnect Dept., Hirose Electr. USA, Inc., Santa Clara, CA, USA
  • fYear
    2014
  • Firstpage
    191
  • Lastpage
    194
  • Abstract
    This paper presents the design of electrical interconnect for high-speed data transmission involving differential signal vias on printed circuit board (PCB). Between two channels of differential vias, with given intra pair via pitch and spacing from adjacent channel vias, there exists an offset angle where differential crosstalk is minimized. By studying single-ended terms of NEXT and FEXT relation in both time and frequency domain, it becomes clear that such phenomenon occurs once in every quadrant. The crosstalk reduction can be achieved without placing ground vias in between signal vias of two channels, giving more routing space in high-speed PCB designs.
  • Keywords
    crosstalk; integrated circuit interconnections; printed circuit design; three-dimensional integrated circuits; FEXT; NEXT; adjacent channel vias; crosstalk reduction; differential crosstalk; differential signal vias; electrical interconnect; high-speed PCB design; high-speed data transmission; intrapair via pitch; printed circuit board; single-ended terms; time-frequency domain; Crosstalk; Data communication; Frequency-domain analysis; Microwave technology; Routing; Time-domain analysis; crosstalk reduction; differential via; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
  • Print_ISBN
    978-1-4799-3641-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2014.7103631
  • Filename
    7103631