DocumentCode
3589016
Title
Method of moments based on isogeometric analysis for electrostatic field simulations of curved multiconductor transmission lines
Author
Sekine, Tadatoshi ; Miura, Kenjiro T. ; Asai, Hideki
Author_Institution
Dept. of Mech. Eng., Shizuoka Univ., Hamamatsu, Japan
fYear
2014
Firstpage
195
Lastpage
198
Abstract
This paper describes a method of moments (MoM) based on isogeometric analysis (IGA) for electrostatic field simulations of curved multiconductor transmission lines (MTLs). IGA is a novel concept introduced in the fields of numerical analysis and computer-aided design (CAD) for mechanical engineering. In IGA, B-spline functions are used for both representing curved objects in CAD and approximating variables of a governing equation in analysis. Therefore, we can directly use the exact geometries for the analysis without mesh generation. In contrast to the original IGA, in which a finite element method is basically used as a numerical analysis method, we apply the IGA formulation to MoM to solve the electrostatic field problems on curved conductor lines. Numerical results show that the proposed method can provide accurate results and perform faster simulations than those based on a conventional mesh-based MoM in example analyses.
Keywords
electric fields; finite element analysis; method of moments; multiconductor transmission lines; splines (mathematics); B-spline functions; CAD; IGA formulation; MTL; MoM; computer-aided design; curved conductor lines; curved multiconductor transmission lines; curved objects; electrostatic field simulations; exact geometries; finite element method; isogeometric analysis; method of moments; numerical analysis; Design automation; Electrostatics; Finite element analysis; Geometry; Method of moments; Solid modeling; Splines (mathematics); computer-aided design (CAD); curved conductor; electrostatic field simulation; isogeometric analysis (IGA); method of moments (MoM); multiconductor transmission lines (MTLs);
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN
978-1-4799-3641-0
Type
conf
DOI
10.1109/EPEPS.2014.7103632
Filename
7103632
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