• DocumentCode
    3589016
  • Title

    Method of moments based on isogeometric analysis for electrostatic field simulations of curved multiconductor transmission lines

  • Author

    Sekine, Tadatoshi ; Miura, Kenjiro T. ; Asai, Hideki

  • Author_Institution
    Dept. of Mech. Eng., Shizuoka Univ., Hamamatsu, Japan
  • fYear
    2014
  • Firstpage
    195
  • Lastpage
    198
  • Abstract
    This paper describes a method of moments (MoM) based on isogeometric analysis (IGA) for electrostatic field simulations of curved multiconductor transmission lines (MTLs). IGA is a novel concept introduced in the fields of numerical analysis and computer-aided design (CAD) for mechanical engineering. In IGA, B-spline functions are used for both representing curved objects in CAD and approximating variables of a governing equation in analysis. Therefore, we can directly use the exact geometries for the analysis without mesh generation. In contrast to the original IGA, in which a finite element method is basically used as a numerical analysis method, we apply the IGA formulation to MoM to solve the electrostatic field problems on curved conductor lines. Numerical results show that the proposed method can provide accurate results and perform faster simulations than those based on a conventional mesh-based MoM in example analyses.
  • Keywords
    electric fields; finite element analysis; method of moments; multiconductor transmission lines; splines (mathematics); B-spline functions; CAD; IGA formulation; MTL; MoM; computer-aided design; curved conductor lines; curved multiconductor transmission lines; curved objects; electrostatic field simulations; exact geometries; finite element method; isogeometric analysis; method of moments; numerical analysis; Design automation; Electrostatics; Finite element analysis; Geometry; Method of moments; Solid modeling; Splines (mathematics); computer-aided design (CAD); curved conductor; electrostatic field simulation; isogeometric analysis (IGA); method of moments (MoM); multiconductor transmission lines (MTLs);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
  • Print_ISBN
    978-1-4799-3641-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2014.7103632
  • Filename
    7103632