DocumentCode :
3589462
Title :
An experimental characterization of Au-, Ru-, Rh- and Ni- based microcontacts for MEMS
Author :
Broue, Adrien ; Dhennin, J?©r?©mie ; Charvet, Pierre-Louis ; Courtade, Fr?©d?©ric ; Heeb, Peter ; Pons, Patrick ; Plana, Robert
Author_Institution :
NOVAMEMS, CNES, Toulouse, France
fYear :
2010
Firstpage :
397
Lastpage :
402
Abstract :
From several years, NOVA MEMS has developed a new set-up for the characterization of contact materials used in micro- switches. Comparisons between several pairs of contact materials have been done with this methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate the underlying physics that drives the surface-related failure modes. The data provides a better understanding of micro-contact behaviour related to the impact of current at low- to medium-power levels. The decrease of the contact resistance, when the contact force increases, is measured for contact pairs of soft material (Au/Au contact), harder materials (Ru/Ru and Rh/Rh contacts) and mixed configuration (Au/Ru and Au/Ni contacts). The super-temperatures of the contacts have been calculated and compared to the theoretical values of softening temperature for each material. It can be shown that this temperature can be reached for gold, ruthenium and rhodium material, with different levels of current intensity. However, no softening behaviour has been highlighted for mixed contact. An enhanced stability of the bimetallic contacts Au/Ru and Au/Ni was demonstrated considering sensitivity to power increase, related to thermo-mechanical deformations and topological modifications of the contact asperities. These results are discussed in a theoretical way by considering the temperature distribution around the hottest niveau-surface at the contact interface.
Keywords :
contact resistance; deformation; gold; micromechanical devices; nickel; rhodium; ruthenium; Au; Au-based microcontacts; MEMS; Ni; Ni-based microcontacts; Rh; Rh-based microcontacts; Ru; Ru-based microcontacts; bimetallic contacts; contact materials; contact resistance; microswitches; surface-related failure modes; temperature distribution; thermo-mechanical deformations; Contacts; Couplings; Electric variables measurement; Electrical resistance measurement; Force measurement; Gold; Materials testing; Micromechanical devices; Softening; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
Type :
conf
Filename :
5486483
Link To Document :
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