Continuous nano/micro-machining and weaving integration process for fiber substrates

We report on the reel to reel process including coating and patterning fibers and their weaving integration process for the application to large area (> 1 m²) MEMS devices. Firstly, large area applications are discussed and the difficulty to apply MEMS process to meter-scale devices regarding on throughput and high-cost of materials are pointed out. Secondly, toward high throughput processing, we proposed the die-coating technology applied to plastic fibers and the weaving of them, forming large area-device. To solve the high cost of materials, we proposed to utilize plastic fiber substrates and organic electronic material as low cost materials. Thirdly, we established the device fabrication process and fabricated a 30 cm × 30 cm pressure sensor array. Finally, its mechanical and electrical properties were examined and pressure sensing was demonstrated using fabricated device. The developed process will lead to large area pressure sensors and other electronic devices.