Advanced fault localization techniques in microelectronics failure analysis

Author

Xuanlong Chen ; Guanghua Yuan ; Guangning Xu ; Liyuan Liu ; Xianjun Kuang

Author_Institution

Reliability Anal. & Res. Centre, China Electron. Product Reliability & Environ. Testing Inst., Guangzhou, China

fYear

2014

Firstpage

5

Lastpage

9

Abstract

Failure analysis (FA) plays an important role in semiconductor industry as the process technology and new packaging are continuously improved. Fault localization is a key step to narrow down the area of failed part and isolate the defective areas, which is prior to destructive failure analysis. This paper will cover some advanced fault localization techniques and tools in package and die/device level failure analysis. Case studies for those techniques will provide a good understanding and illustrate the applications.

Keywords

failure analysis; fault diagnosis; integrated circuit packaging; integrated circuit reliability; FA; advanced fault localization techniques; device level failure analysis; die level failure analysis; microelectronics failure analysis; package analysis; process technology; semiconductor industry; Circuit faults; Failure analysis; Integrated circuits; Metals; Microscopy; X-ray imaging; OBIRCH; PEM; SAM; X-RAY; failure analysis; fault localization; lock-in thermography; microelectronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on

Print_ISBN

978-1-4799-6631-8

Type

conf

DOI

10.1109/ICRMS.2014.7107124

Filename

7107124