Title :
Advanced fault localization techniques in microelectronics failure analysis
Author :
Xuanlong Chen ; Guanghua Yuan ; Guangning Xu ; Liyuan Liu ; Xianjun Kuang
Author_Institution :
Reliability Anal. & Res. Centre, China Electron. Product Reliability & Environ. Testing Inst., Guangzhou, China
Abstract :
Failure analysis (FA) plays an important role in semiconductor industry as the process technology and new packaging are continuously improved. Fault localization is a key step to narrow down the area of failed part and isolate the defective areas, which is prior to destructive failure analysis. This paper will cover some advanced fault localization techniques and tools in package and die/device level failure analysis. Case studies for those techniques will provide a good understanding and illustrate the applications.
Keywords :
failure analysis; fault diagnosis; integrated circuit packaging; integrated circuit reliability; FA; advanced fault localization techniques; device level failure analysis; die level failure analysis; microelectronics failure analysis; package analysis; process technology; semiconductor industry; Circuit faults; Failure analysis; Integrated circuits; Metals; Microscopy; X-ray imaging; OBIRCH; PEM; SAM; X-RAY; failure analysis; fault localization; lock-in thermography; microelectronics;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
Print_ISBN :
978-1-4799-6631-8
DOI :
10.1109/ICRMS.2014.7107124
