DocumentCode :
3589753
Title :
A prognostic cell for electromigration failure of integrated circuit
Author :
Xu, X.B. ; Chen, Y.Q. ; Lu, Y.D. ; Wang, B.
Author_Institution :
Sch. of Mater. Sci. & Eng., South China Univ. of Technol., Guangzhou, China
fYear :
2014
Firstpage :
66
Lastpage :
69
Abstract :
As we know, expendable prognostic cell, such as "canary" and fuse, is a kind of method that can be applied for prognostics, and it fails earlier than the host product, which provides advance warning of failure. In this paper, a prognostic cell was proposed for electromigration (EM) failure of integrated circuit(IC), and it is composed of stress and detection module, two-stage low gain amplifier, high gain comparator, non-overlapping clock generation module, bias voltage generation module, and output module. The prognostic cell was designed to fail faster than host circuit, and was successfully simulated on the base of SMIC 0.18 urn mixed-signal CMOS process model. The output of the prognostic cell could accurately flip from low voltage to high voltage as the amount of resistance increased by more than 20% caused by EM, and the function was verified experimentally. This indicates the impending failure of host circuit, which shows that the present prognostic cell can be used to provide advance warning of EM failure. The research results are useful for the reliability insurance and failure prediction of IC.
Keywords :
CMOS integrated circuits; electromigration; failure analysis; integrated circuit reliability; mixed analogue-digital integrated circuits; EM failure; IC; SMIC mixed-signal CMOS process model; bias voltage generation module; clock generation module; detection module; electromigration failure; expendable prognostic cell; failure prediction; high gain comparator; host circuit; integrated circuit; non-overlapping clock generation; reliability insurance; size 18 mum; stress module; two-stage low gain amplifier; Clocks; Computer architecture; Electromigration; Integrated circuits; Resistance; Stress; Voltage measurement; Electromigration; Failure; Integrated circuit; Prognostic cell;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
Print_ISBN :
978-1-4799-6631-8
Type :
conf
DOI :
10.1109/ICRMS.2014.7107138
Filename :
7107138
Link To Document :
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