• DocumentCode
    3589760
  • Title

    Supply voltage dependence of single event upset sensitivity in diverse SRAM devices

  • Author

    Zhangang Zhang ; Jie Liu ; Youmei Sun ; Mingdong Hou ; Teng Tong ; Song Gu ; Tianqi Liu ; Chao Geng ; Kai Xi ; Huijun Yao ; Jie Luo ; Jinglai Duan ; Dan Mo ; Hong Su ; Zhangang Zhang ; Zhifeng Lei ; Yunfei En ; Yun Huang

  • Author_Institution
    Mater. Res. Center, Inst. of Modern Phys., Lanzhou, China
  • fYear
    2014
  • Firstpage
    114
  • Lastpage
    119
  • Abstract
    Experimental evidences are presented showing the variety of supply voltage dependence of single event upset (SEU) sensitivity in diverse SRAM devices. Devices under test (DUTs) from Alliance Memory, ISSI and IDT companies with different technologies were irradiated by several kinds of heavy ions at Heavy ion Research Facility in Lanzhou (HIRFL) cyclotrons. For the Alliance 256 kb SRAM device, SEU cross section increases by more than one order of magnitude as supply voltage decreases from 5.0 V to 3.0 V. SEU data of Alliance 64 kb SRAM also exhibits significant supply voltage dependence. The reduction of critical charge is the predominant factor worsening the device performance. While for the Alliance 8 Mb, ISSI 2 Mb and IDT 256 kb SRAM devices, no obvious trend was observed, which is attributed to the negligible net contribution of competing mechanisms. Those results suggest that the worst-case supply voltage for evaluation of SEU sensitivity depends on the test devices.
  • Keywords
    SRAM chips; radiation hardening (electronics); SEU sensitivity; diverse SRAM device; memory size 2 MByte; memory size 256 KByte; memory size 8 MByte; single event upset sensitivity; supply voltage dependence; MOSFET; Random access memory; Sensitivity; Silicon; Single event upsets; Transient analysis; critical charge; single event upset; static random access memeory; supply voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
  • Print_ISBN
    978-1-4799-6631-8
  • Type

    conf

  • DOI
    10.1109/ICRMS.2014.7107149
  • Filename
    7107149