Title :
Location techniques of failure analysis ESD damage in electronic component
Author :
Ping Lai ; Youliang Wang ; Xiaosi Liang ; Xianjun Kuang ; Jinlin Zou
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
Abstract :
ESD damage is often slight and even imperceptible. It is important to locate the damage in order to make sure if the damage is caused by ESD or not, before correct improvements can be adopted. Some location techniques of failure analysis for ESD damage in electronic devices are presented.
Keywords :
electrostatic discharge; failure analysis; integrated circuit testing; semiconductor device testing; ESD damage; electronic component; electronic devices; electrostatic discharge; failure analysis; location techniques; Electrostatic discharges; Failure analysis; Integrated optics; Optical imaging; Optical microscopy; Scanning electron microscopy; ESD; Failure Analysis; Location Techniques;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
Print_ISBN :
978-1-4799-6631-8
DOI :
10.1109/ICRMS.2014.7107152
