DocumentCode
3589775
Title
The channel temperature dependence of drain transient response in AlGaN/GaN HEMTs
Author
Yamin Zhang ; Shiwei Feng ; Hui Zhu ; Xueqin Gong ; Chunsheng Guo
Author_Institution
Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
fYear
2014
Firstpage
201
Lastpage
204
Abstract
The channel temperature dependence of the drain current transient responses of AlGaN/GaN HEMTs are studied by experimental measurement and simulation. The relationship between the channel transient temperature rise and drain current drop are discussed in detail. The results show that the temperature is the main factor for the drain current decrease. Two shoulders exist on the transient drain current response curve. The time for the shoulders appear depends on the thermal time constant, which is 10 ms and 60 s in the case. The decrease of transient drain current and transient temperature rise have a complementary relationship. Furthermore, the measurement results are found to be consistent with the electro-thermal simulation results.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; transient response; wide band gap semiconductors; AlGaN-GaN; HEMT; channel temperature dependence; channel transient temperature rise; drain current drop; drain current transient responses; electrothermal simulation; thermal time constant; time 10 ms; time 60 s; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Temperature measurement; Thermal resistance; Transient analysis; AlGaN/GaN HEMTs; channel temperature; drain current; self-heating; transient response;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
Print_ISBN
978-1-4799-6631-8
Type
conf
DOI
10.1109/ICRMS.2014.7107170
Filename
7107170
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