• DocumentCode
    3589775
  • Title

    The channel temperature dependence of drain transient response in AlGaN/GaN HEMTs

  • Author

    Yamin Zhang ; Shiwei Feng ; Hui Zhu ; Xueqin Gong ; Chunsheng Guo

  • Author_Institution
    Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
  • fYear
    2014
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    The channel temperature dependence of the drain current transient responses of AlGaN/GaN HEMTs are studied by experimental measurement and simulation. The relationship between the channel transient temperature rise and drain current drop are discussed in detail. The results show that the temperature is the main factor for the drain current decrease. Two shoulders exist on the transient drain current response curve. The time for the shoulders appear depends on the thermal time constant, which is 10 ms and 60 s in the case. The decrease of transient drain current and transient temperature rise have a complementary relationship. Furthermore, the measurement results are found to be consistent with the electro-thermal simulation results.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; transient response; wide band gap semiconductors; AlGaN-GaN; HEMT; channel temperature dependence; channel transient temperature rise; drain current drop; drain current transient responses; electrothermal simulation; thermal time constant; time 10 ms; time 60 s; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Temperature measurement; Thermal resistance; Transient analysis; AlGaN/GaN HEMTs; channel temperature; drain current; self-heating; transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
  • Print_ISBN
    978-1-4799-6631-8
  • Type

    conf

  • DOI
    10.1109/ICRMS.2014.7107170
  • Filename
    7107170