Effect of reflow profile parameters on shear performance of Sn3.0Ag0.5Cu/Cu solder joint

Author

Xin Wang ; Xunping Li ; Kailin Pan ; Bin Zhou ; Tingbiao Jiang

Author_Institution

Sch. of Mech. & Electron. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2014

Firstpage

691

Lastpage

693

Abstract

The relationship between reflow profile parameters (soak temperature and soak time, reflow temperature and reflow time, cooling rate) and shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated. It was found that soak time, reflow temperature and cooling rate had significant influence on the shear performance of Sn3.0Ag0.5Cu/Cu. Adequately prolong soak time and increase reflow temperature would help to improve the shear force of joint. The fast cooling rate is benefit to improve the shear performance of SAC/Cu joint. However, too fast cooling rate may result in residual stress in solder joint.

Keywords

cooling; copper; reflow soldering; semiconductor device reliability; silver compounds; solders; surface mount technology; tin compounds; SAC/Cu; Sn_3.0Ag_0.5Cu-Cu; cooling rate; reflow profile parameters; reflow temperature; reflow time; soak temperature; soak time; solder joint; Cooling; Force; Joints; Microstructure; Reliability; Soldering; Surface treatment; cooling rate; ręflow temperature; ręflow time; reflow profile; soak temperature; soak time;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on

Print_ISBN

978-1-4799-6631-8

Type

conf

DOI

10.1109/ICRMS.2014.7107286

Filename

7107286