Influence mechanism of pad type on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint

Author

Xin Wang ; Xunping Li ; Kailin Pan ; Bin Zhou ; Tingbiao Jiang

Author_Institution

Sch. of Mech. & Electron. Eng., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2014

Firstpage

694

Lastpage

697

Abstract

The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The shear force of NSMD solder joint was significantly higher than SMD solder joint by using ball shear test method according to JSED22-B117A standard. The difference in shear force was attributed to the different distribution of stress of the solder joint by using different pad type during shear testing. The location of maximum vians stress in solder joint with NSMD pad changed from the right corner of joint to the boundary of substrate and pad with test time going on. However, the maximum stress always located at the right corner of joint and the end of ram for joint with SMD type pad. The different distribution of stress resulted to a distinct failure model of solder joint.

Keywords

copper alloys; failure (mechanical); finite element analysis; materials testing; silver alloys; solders; tin alloys; FEA method; JSED22-B117A standard; NSMD pad; NSMD solder joint; SMD type pad; Sn_3.0Ag_0.5Cu-Cu; ball shear test method; failure model; finite element analysis; influence mechanism; nonsolder mask defined solder joint; shear force; shear performance; shear testing; Finite element analysis; Force; Joints; Random access memory; Reliability; Soldering; Stress; non-solder mask defined; pad type; shear performance; solder mask defined;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on

Print_ISBN

978-1-4799-6631-8

Type

conf

DOI

10.1109/ICRMS.2014.7107287

Filename

7107287