The reliability study of 0.13μm CMOS process

When the Minimum channel length shrink to 0.13μιη, As the device geometry size scaling down while the operation voltage of the device decreased, but the electric field increase. The current density is still high in interconnect line, various failure mechanisms still exist in the process generation of copper interconnect/low k dielectric integrated, the reliability is still a very important problem. By using accelerated test, the reliability of the main failure mechanisms have been evaluated, the results showed that the lifetimes of main failure mechanism can achieve the requirements of more than 10 years lifetime. In the same time, NBTI effect will become the main failure mechanism in ultra deep sub-micron CMOS process when Minimum channel length becomes less than 0.13 μιη.