DocumentCode :
3590555
Title :
HVVFET™: A new 0.25µm channel length RF POWER MOSFET with ultra low feedback capacitance
Author :
Rice, D. ; Cai, W.Z. ; Gogoi, B.P. ; Watts, M. ; Le, P. ; Davies, R.B. ; Lutz, D.
Author_Institution :
HVVi Semicond., Phoenix, AZ, USA
fYear :
2010
Firstpage :
154
Lastpage :
157
Abstract :
A novel short channel vertical RF MOSFET (termed HVVFET™) has been developed for avionics and L-band radar applications. The HVVFET employs a silicided polysilicon spacer that is formed along a vertical dielectric sidewall to serve as the gate. A second silicided poly layer is sandwiched between the gate interconnects and the Si wafer, thereby completely shielding the gate from the drain. Consequently, the HVVFET exhibits superior device characteristics such as a state of the art BVDSS-RON-SP combination and very low capacitances, in particular, to the authors´ knowledge, a record low Cgd. The packaged HVVFET device with a total gate width of 64.5 mm shows a Cgd of 2.67×10-18 and 2.32×10-18 F/um at 25V and 40V respectively. The capacitance values are 1.65×10-18 and 1.3×10-18 F/um for a bare die under the same biases, representing a five-fold improvement over similar devices in the literature. The packaged HVVFET device exhibits superior RF performances in the 1.0-1.2GHz band, including a 19dB power gain, 0.8W/mm output power at ldB compression and 45% PAE, and a 20:1 load mismatch survivability.
Keywords :
power MOSFET; HVVFET; L-band radar application; RF POWER MOSFET; Si wafer; avionics; silicided poly layer; silicided polysilicon spacer; size 0.25 mum; ultra low feedback capacitance; vertical dielectric sidewall; Capacitance; Logic gates; MOSFET circuits; Metals; Performance evaluation; Radio frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2010 European
Print_ISBN :
978-1-4244-7231-4
Type :
conf
Filename :
5613720
Link To Document :
بازگشت