DocumentCode
3590790
Title
Remotely adjustable check-valves with an electrochemical release mechanism for implantable biomedical microsystem
Author
Pan, Tingrui ; Baldi, Antonio ; Ziaie, Babak
Author_Institution
Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
Volume
1
fYear
2004
Firstpage
2658
Lastpage
2661
Abstract
We present two remotely adjustable check-valves with an electrochemical release mechanism for implantable biomedical microsystems. Using these valves, one can vary the opening pressure set-point and flow resistance over a period of time. In the first design, an array of remotely addressable valves with a SU-8 structural polymer layer deposited on the top of a gold sacrificial layer act as the micromachined check-valve. In an alternative design, the set point is changed by varying the length of a cantilever-beam. The adjustable cantilever-beam structure is fabricated by gold thermo-compression bond of a thin silicon wafer over a glass substrate. The evaporated gold forms anchors on the silicon and strips on the glass substrate. Adjustment of both microvalves is based on electrochemical dissolution of gold using a constant DC current obtained via a telemetry link. A current density of 35mA/cm2 is used to activate the valves. Both gravity and syringe-pump driven flow are used to characterize the valve performance. The multistage fluidic performance (e.g. flow resistance and opening pressure) is clearly demonstrated.
Keywords
electrochemistry; gold; micromachining; microvalves; polymer films; prosthetics; silicon; telemetry; Au; Si; biomedical microsystem; cantilever-beam structure fabrication; electrochemical release mechanism; flow resistance; glass substrate; gold sacrificial layer; gold thermo-compression bond; micromachined check-valve; microvalves; structural polymer layer deposition; telemetry link; thin silicon wafer; Glass; Gold; Immune system; Microvalves; Polymers; Silicon; Strips; Telemetry; Valves; Wafer bonding; Electrochemical Release; Microvalves; SU-8; Thermo-compression Bond;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Print_ISBN
0-7803-8439-3
Type
conf
DOI
10.1109/IEMBS.2004.1403762
Filename
1403762
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