Title :
Remotely adjustable check-valves with an electrochemical release mechanism for implantable biomedical microsystem
Author :
Pan, Tingrui ; Baldi, Antonio ; Ziaie, Babak
Author_Institution :
Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
Abstract :
We present two remotely adjustable check-valves with an electrochemical release mechanism for implantable biomedical microsystems. Using these valves, one can vary the opening pressure set-point and flow resistance over a period of time. In the first design, an array of remotely addressable valves with a SU-8 structural polymer layer deposited on the top of a gold sacrificial layer act as the micromachined check-valve. In an alternative design, the set point is changed by varying the length of a cantilever-beam. The adjustable cantilever-beam structure is fabricated by gold thermo-compression bond of a thin silicon wafer over a glass substrate. The evaporated gold forms anchors on the silicon and strips on the glass substrate. Adjustment of both microvalves is based on electrochemical dissolution of gold using a constant DC current obtained via a telemetry link. A current density of 35mA/cm2 is used to activate the valves. Both gravity and syringe-pump driven flow are used to characterize the valve performance. The multistage fluidic performance (e.g. flow resistance and opening pressure) is clearly demonstrated.
Keywords :
electrochemistry; gold; micromachining; microvalves; polymer films; prosthetics; silicon; telemetry; Au; Si; biomedical microsystem; cantilever-beam structure fabrication; electrochemical release mechanism; flow resistance; glass substrate; gold sacrificial layer; gold thermo-compression bond; micromachined check-valve; microvalves; structural polymer layer deposition; telemetry link; thin silicon wafer; Glass; Gold; Immune system; Microvalves; Polymers; Silicon; Strips; Telemetry; Valves; Wafer bonding; Electrochemical Release; Microvalves; SU-8; Thermo-compression Bond;
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Print_ISBN :
0-7803-8439-3
DOI :
10.1109/IEMBS.2004.1403762