DocumentCode :
3591077
Title :
Innovative practices session 5C: Advancements in test -keeping moore moving!
Author :
Amyeen, Enamul
Author_Institution :
Intel, USA
fYear :
2015
Firstpage :
1
Lastpage :
1
Abstract :
This talk focuses on test and debug challenges that are unique to large die products. A technical review of problems being faced today specific to test quality, test time, test cost, electrical and speed content, and debug will be outlined along with some current solutions being pursued to drive large die products to production quality. The talk concludes with a discussion about new solutions and areas of innovation that will be necessary to keep future generations of these products manufacturable, and on a cadence that meets the stringent time to market requirements.
Keywords :
Built-in self-test; Manufacturing; Production; Technological innovation; Time to market; Transistors; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium (VTS), 2015 IEEE 33rd
Type :
conf
DOI :
10.1109/VTS.2015.7116272
Filename :
7116272
Link To Document :
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