DocumentCode
3591112
Title
Metal-cavity nanolasers: How small can they go?
Author
Chuang, Shun Lien ; Lu, Chien-Yao ; Matsudaira, Akira
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2011
Firstpage
1
Lastpage
4
Abstract
We present a theory of metal-cavity nanolasers and our progress in experiments of metal-cavity surface-emitting microlasers and nanoLEDs with electrical injection at room temperature. After substrate removal, the devices are flip-chip bonded to silicon. The fabrication concepts represent significant progress toward integration of active nanophotonic devices with silicon electronics.
Keywords
bonding processes; flip-chip devices; integrated optoelectronics; laser cavity resonators; light emitting diodes; micro-optics; nanophotonics; surface emitting lasers; active nanophotonic device; electrical injection; flip chip bonding; metal cavity nanolaser; metal cavity surface emitting microlasers; nanoLED; silicon electronics; temperature 293 K to 298 K; Indium phosphide; Metals; Optical pumping; Optical reflection; Optical surface waves; Stimulated emission; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Microopics Conference (MOC), 2011 17th
Print_ISBN
978-1-4577-1344-6
Type
conf
Filename
6110257
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