• DocumentCode
    3591465
  • Title

    Thermal analysis and optimization of temperature rise in busbar joints configuration by FEM

  • Author

    Lotiya, Jugal

  • Author_Institution
    Electr. Eng. Dept., Indus Univ., Ahmedabad, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The busbar systems are introduced, typically in industries for large scale power distribution. As a high power distribution with large current raises heat loss and temperature rise problems at busbar joints. This paper deal with thermal analysis of various joint configurations of high power busbar system and shows how the temperature can be reduced by introducing slots in true contact area. The finite element method is employed for thermal analysis and simulation is carried out with ANSYS multi physics software. The simulation results are compared with experimental solutions.
  • Keywords
    busbars; finite element analysis; heat losses; power distribution; thermal analysis; ANSYS multiphysics software; FEM; busbar joint configuration; busbar system; finite element method; heat loss; large scale power distribution; temperature rise optimization; thermal analysis; Assembly; Contact resistance; Fasteners; Finite element analysis; Joints; Temperature distribution; temperature distribution; true contact region;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power India International Conference (PIICON), 2014 6th IEEE
  • Print_ISBN
    978-1-4799-6041-5
  • Type

    conf

  • DOI
    10.1109/34084POWERI.2014.7117684
  • Filename
    7117684