A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems

Author

Lung, H.L. ; Breitwisch, M. ; Wu, J.Y. ; Du, Pei-Ying ; Zhu, Y. ; Lee, M.H. ; Shih, Y.H. ; Lai, E.K. ; Dasaka, R. ; Wang, T.Y. ; Chen, C.F. ; Cheek, R. ; Schrott, A. ; Joseph, E. ; Cheng, H.Y. ; Raoux, S. ; Lam, C.

Author_Institution

IBM/Macronix PCRAM Joint Project, Macronix Int. Co. Ltd., China

fYear

2011

Firstpage

98

Lastpage

99

Abstract

For the first time we demonstrate that a Phase Change Memory (PCM) packaged chip can hold pre-coded data after an industrial standard lead free solder bonding reflow process. Good “0” and “1” state distributions are retained in a 90nm 128Mb PCM chip after the soldering process. Furthermore, the tested chip endures more than 10 million write cycles after the pre-coding and high temperature process.

Keywords

bonding processes; integrated circuit packaging; phase change memories; precoding; reflow soldering; solders; PCM packaged chip; embedded systems; high-temperature solder bonding process; industrial standard lead-free solder bonding reflow process; phase change memory; precoding data retention; size 90 nm; Bonding; Environmentally friendly manufacturing techniques; Lead; Phase change materials; Resistance; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology (VLSIT), 2011 Symposium on

ISSN

0743-1562

Print_ISBN

978-1-4244-9949-6

Type

conf

Filename

5984658