• DocumentCode
    3592536
  • Title

    Graphene heat spreader for thermal management of hot spots in electronic packaging

  • Author

    Zhaoli Gao ; Yong Zhang ; Yifeng Fu ; Yuen, Michelle ; Johan Liu

  • Author_Institution
    Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Monolayer graphene was fabricated using thermal CVD for the application of heat spreader in electronic packaging. Platinum (Pt) micro-heater embedded thermal testing chips were utilized to evaluate the thermal performance of the graphene heat spreader. The hot spot temperature was decreased by about 5 °C at a heat flux of up to 800W/cm2. It is possible to further improve the thermal performance of graphene heat spreader by optimizing the synthesis parameters and transfer process.
  • Keywords
    chemical vapour deposition; graphene; heat transfer; monolayers; platinum; thermal management (packaging); electronic packaging; graphene heat spreader; heat flux; hot spot temperature; hot spots; monolayer graphene; platinum microheater embedded thermal testing chips; thermal CVD; thermal management; thermal performance evaluation; transfer process; Electronic packaging thermal management; Heat transfer; Materials; Resistance heating; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
  • Print_ISBN
    978-1-4673-1882-2
  • Type

    conf

  • Filename
    6400590
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3592536