Title :
Graphene heat spreader for thermal management of hot spots in electronic packaging
Author :
Zhaoli Gao ; Yong Zhang ; Yifeng Fu ; Yuen, Michelle ; Johan Liu
Author_Institution :
Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Gothenburg, Sweden
Abstract :
Monolayer graphene was fabricated using thermal CVD for the application of heat spreader in electronic packaging. Platinum (Pt) micro-heater embedded thermal testing chips were utilized to evaluate the thermal performance of the graphene heat spreader. The hot spot temperature was decreased by about 5 °C at a heat flux of up to 800W/cm2. It is possible to further improve the thermal performance of graphene heat spreader by optimizing the synthesis parameters and transfer process.
Keywords :
chemical vapour deposition; graphene; heat transfer; monolayers; platinum; thermal management (packaging); electronic packaging; graphene heat spreader; heat flux; hot spot temperature; hot spots; monolayer graphene; platinum microheater embedded thermal testing chips; thermal CVD; thermal management; thermal performance evaluation; transfer process; Electronic packaging thermal management; Heat transfer; Materials; Resistance heating; Testing;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Print_ISBN :
978-1-4673-1882-2
