Structural analysis of an electronic module incorporating hybrid microcircuits in power distribution package of satellites

Electronic equipment can be subjected to a wide range of vibratory loads which is nowhere more evident than in the ones employed in satellites. The mechanical enclosures and the sensitive electronic sub-assemblies have to be designed to survive the launch loads with high reliability and to endure the harsh space environment in orbit throughout the intended mission life of a satellite. The design and analysis of such a sensitve sub-assembly, the shunt switch module incorporating Hybrid Micro Circuits - HMCs used in power distribution package of satellites, by finite element method is presented. The modeling and numerical simulations are carried out using UG NX 7.5 to evaluate the design. The natural frequency of card (640.1 Hz) and assembly (452.0 Hz) comply with general stiffness. The stress values under static and random loading are nominal for PCB and base module. There is a very good margin of safety (MOS) over allowable strength of PCB and base module material. The results of static, modal and random analyses validate the adequacy of design.