DocumentCode :
3592895
Title :
Improving reliability for electronic power modules
Author :
Manikam, Vemal Raja ; Tolentino, Erik Nino ; Ramuhzan, Fadhilah Nurani ; Tajuddin, Nik Mohd ; Aripin, Azhar
Author_Institution :
Package Innovation & Dev. Center, ON Semicond. (M) Sdn Bhd, Seremban, Malaysia
fYear :
2014
Firstpage :
1
Lastpage :
5
Abstract :
The current trend in power electronics, particularly for power module development is focused on improved reliability, quality and energy efficiency. In applications such as in railways or heavy machinery, high power in the ranges of several hundred kilowatts to lower megawatts is required. Innovation in such areas are needed to improve the systems reliability as failures could be extremely costly to replace. In some cases they may involve loss of life. Most systems are expected to function constantly on daily cycles and may be subjected to harsh environments as well. Power module systems today seek to integrate more functions by implementing good electrical design principles. Such ideas can only be realized if the materials and processes used are reliable and robust. The main objective of this literature work is to understand the reliability problems and failures, as well as improvements which are being made on engineering material selection for power modules.
Keywords :
power electronics; reliability; electrical design principles; electronic power modules; energy efficiency; engineering material selection; machinery; power electronics; power module development; reliability problems; Heating; Materials reliability; Multichip modules; Substrates; Temperature; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
Type :
conf
DOI :
10.1109/IEMT.2014.7123105
Filename :
7123105
Link To Document :
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