Crack block: A pro active activity on die crack resolution for thin dies

With the on going drive to reduce costs for its packages. ON Semiconductor assembly sites have done extensive efforts to reduce package costs aiming primarily on the Bill of Material The initial stimulus is brought about by a customer requirement for a device with similar footprint but with a lower profile. The stack analysis conducted during package design entailed a required maximum die thickness of 113μm (4.5 mils). Subsequent Design Failure Mode and Effect Analysis (DFMEA) conducted came up with several possible failure modes. One of them was possible die crack during die attach process. This paper aims to explain OSPI-NPD´s pro active exertion to counter possible de crack problem on Very Small Outline Integrated Circuit (VSOIC) Package.