Six sigma: Systematic approach in probe damage reduction

This paper describes how probe damage, the major defect at sort process, was toppled down nearly to ground level using the systematic approach of Six Sigma. A thorough study on the characteristic of the probe damage was made. Using root cause analysis tools, such as process mapping, cause and effect matrix, significance testing, and other useful quality tools, the sources of probe damage were identified, validated and solutions were developed. The PPM level of probe damage was significantly reduced resulting to less wafer scrappage, high yield and improvement on sort process efficiency.