Title :
Research and development of new generation High Voltage Flip Chip LED
Author :
Soon Lee Tan ; Si Teng Zhang ; Tian Cheng Zhang
Author_Institution :
Elec-Tech Photoelectric Technol. (Dalian) Co. Ltd., Dalian, China
Abstract :
This paper presents the development and performance of a new generation of Direct Attach middle power 6V High Voltage Flip Chip (HVFC) LED designed to be directly attached using AuSn or SnAgCu solder by surface mount technology (SMT). Comparison is made against a standard 3V Flip Chip (FC) LED of equal chip dimension (780um × 380um). At 0.5W operation, both HVFC and FC have comparable Wall Plug Efficiency of 37% and Luminous Efficacy of 120lm/W at 6500K CCT, 70 CRI.
Keywords :
flip-chip devices; light emitting diodes; solders; surface mount technology; HVFC LED; SMT; high voltage flip chip LED; luminous efficacy; surface mount technology; wall plug efficiency; Electrodes; Flip-chip devices; Gallium nitride; Junctions; Light emitting diodes; Plugs; Standards;
Conference_Titel :
Solid State Lighting (SSLCHINA), 2014 11th China International Forum on
Print_ISBN :
978-1-4799-6696-7
DOI :
10.1109/SSLCHINA.2014.7127220
