Effect of material creeping on the reliability of thermal interface of LED spotlight module

Author

Hongyu Tang ; Yong Yu ; Min Jia ; Leung, Stanley Y. Y. ; Cheng Qian ; Yuan, Cadmus C. A. ; Xiang Zhou ; Zhang, G.Q.

Author_Institution

State Key Lab. of Solid-State Lighting, Changzhou, China

fYear

2014

Firstpage

120

Lastpage

124

Abstract

In this study, the reliability of LED spotlight module with consideration of the contact between a module made of polybutylene terephthalate (PBT) and the aluminum heat sink is investigated by non-linear finite element modeling. The mechanical behavior of the contact interface under high temperature storage was simulated. The force applied on the thermal interface (F_TIM) was obtained from the simulation and experiments. The simulation results agree with the experimental measurement. The proposed simulation is an efficient tool to depict the effect of the creeping of PBT on the reliability of thermal interface of LED spotlight module.

Keywords

LED lamps; aluminium; finite element analysis; heat sinks; lighting; reliability; LED spotlight module reliability; PBT creeping effect; aluminum heat sink; contact interface; high-temperature storage; material creeping effect; mechanical behavior; nonlinear finite element modeling; polybutylene terephthalate; thermal interface reliability; Finite element analysis; Force; Heat sinks; Light emitting diodes; Reliability; Temperature measurement; Thermal force;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Lighting (SSLCHINA), 2014 11th China International Forum on

Print_ISBN

978-1-4799-6696-7

Type

conf

DOI

10.1109/SSLCHINA.2014.7127236

Filename

7127236