Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

Author

Ghosh, Tamal ; Krishna, V. Siva Rama ; Singh, Shiv Govind

Author_Institution

Dept. of Electr. Eng., IIT Hyderabad, Yeddumailaram, India

fYear

2014

Firstpage

1

Lastpage

4

Abstract

This paper reports low temperature Cu-Cu thermocompression bonding with the help of self-assembled monolayer (SAM) desorption. SAM layer protects copper from oxidation. It should be desorbed just before bonding. The desorption was carried out using cyclic voltammetry in aqueous potassium hydroxide (KOH) solution. Contact angle measurements carried out before and after desorption indicates successful desorption of SAM. The bonding was carried out at 150 °C and has yielded in excellent bond strength of 520 N.

Keywords

copper; desorption; lead bonding; monolayers; oxidation; self-assembly; tape automated bonding; voltammetry (chemical analysis); KOH; SAM desorption; aqueous potassium hydroxide; contact angle measurement; cyclic voltammetry; electrochemical desorption; low temperature copper-copper thermocompression bonding; oxidation; self-assembled monolayer; temperature 150 C; Bonding; Copper; Films; Rough surfaces; Surface roughness; Surface treatment; Temperature measurement; Electrochemical desorption; Low temperature; SAM; Thermocompression bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on

Print_ISBN

978-1-4673-6527-7

Type

conf

DOI

10.1109/ICEmElec.2014.7151165

Filename

7151165