DocumentCode
3596592
Title
VLS growth of silicon nanowires in cold wall Cat-CVD chamber
Author
Acharya, Sanchar ; Kottantharayil, Anil
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Technol. Bombay, Mumbai, India
fYear
2014
Firstpage
1
Lastpage
4
Abstract
Growth of silicon nanowires by Vapour-Liquid-Solid (VLS) method has been studied in a cold wall Catalytic Chemical Vapour Deposition (Cat-CVD) chamber. It has been found that the instrument can be used in two modes, Hot Wire Chemical Vapour Deposition (HWCVD) and Chemical Vapour Deposition (CVD). These modes are tested with two methods for the preparation of the catalyst nanoparticles, namely thermal annealing of catalyst thin film and chemical attachment of catalyst nanoparticles. Growth in HWCVD mode is faster but the nanowires have deformities like conical shape, short length and uncatalyzed silicon deposition on the substrate. Using the CVD mode with modified process parameters solves these problems. The resultant silicon nanowires are characterized by Scanning Electron Microscopy, Energy-dispersive X-ray spectroscopy and Transmission Electron Microscopy.
Keywords
X-ray chemical analysis; annealing; catalysis; catalysts; chemical vapour deposition; elemental semiconductors; nanofabrication; nanoparticles; nanowires; scanning electron microscopy; semiconductor growth; semiconductor thin films; silicon; transmission electron microscopy; HWCVD mode; Si; VLS growth; catalyst nanoparticles; catalyst thin film; chemical attachment; cold wall cat-CVD chamber; cold wall catalytic chemical vapour deposition chamber; energy-dispersive X-ray spectroscopy; hot wire chemical vapour deposition; process parameters; scanning electron microscopy; silicon nanowires; thermal annealing; transmission electron microscopy; uncatalyzed silicon deposition; vapour-liquid- solid method; Annealing; Chemicals; Gold; Nanoparticles; Nanowires; Silicon; Substrates; Cat-CVD; Silicon nanowire; Vapour-Liquid-Solid (VLS) method;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
Print_ISBN
978-1-4673-6527-7
Type
conf
DOI
10.1109/ICEmElec.2014.7151169
Filename
7151169
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