DocumentCode
3596758
Title
Design rule check and layout versus schematic for 3D integration and advanced packaging
Author
Fischbach, Robert ; Heinig, Andy ; Schneider, Peter
Author_Institution
Design Autom. Div. EAS, Fraunhofer Inst. for Integrated Circuits IIS, Dresden, Germany
fYear
2014
Firstpage
1
Lastpage
7
Abstract
In this paper we will present a solution for automatic design rule checking (DRC) and layout versus schematic comparison (LVS) of 2.5D/3D systems, which enables an early check of subcomponents as well as whole system checks. The advantage of our approach is the unique data handling for different DRC and LVS runs, which allows the automatic derivation of partial design data from one single data base. Such an approach is essential for industrial driven designs of 2.5/3D systems. Otherwise, there is a high risk of mistakes related to data conversion and versioning problems. Such data handling issues can result in erroneous designs and cost extensive redesigns.
Keywords
integrated circuit packaging; three-dimensional integrated circuits; 3D integration; advanced packaging; automatic design rule checking; data handling; layout versus schematic; netlist handling; partial design data; physical verification; Data handling; Data models; Integrated circuit modeling; Layout; SPICE; System analysis and design; Three-dimensional displays; 3D integration; DRC; LVS; advanced packaging; chip/package co-design; netlist handling; physical verification;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2014 International
Type
conf
DOI
10.1109/3DIC.2014.7152150
Filename
7152150
Link To Document