• DocumentCode
    3596774
  • Title

    Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects

  • Author

    Chaoqi Zhang ; Thadesar, Paragkumar ; Zia, Muneeb ; Sarvey, Thomas ; Bakir, Muhannad S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Mechanically Flexible Interconnects (MFIs) with a pitch of 50 μm and a standoff height of 65 μm are reported. Mechanical characterization of the MFIs using indentation demonstrates elastic deformation and the feasibility of temporary interconnection. The integration of MFIs and TSVs is also reported along with electrical testing for interposer and 3D IC applications.
  • Keywords
    gold; integrated circuit interconnections; nickel compounds; three-dimensional integrated circuits; 3D interconnects; AuNiW; TSV integration; elastic deformation; electrical testing; interposer; mechanically flexible interconnects; Electrical resistance measurement; Fabrication; Force; Resists; Silicon; Three-dimensional displays; Through-silicon vias; 3D integration; Flexible interconnect; TSV;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2014 International
  • Type

    conf

  • DOI
    10.1109/3DIC.2014.7152166
  • Filename
    7152166
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3596774