Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation

Author

Yang Zhang ; Sarvey, Thomas E. ; Bakir, Muhannad S.

Author_Institution

Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2014

Firstpage

1

Lastpage

5

Abstract

Thermal crosstalk within a heterogeneous 3D IC results in higher temperatures for low-power dice; this is particularly true in memory-logic, photonic-logic, and MEMS-logic stacks. The elevated temperatures may consequently impact the performance of the low-power devices. This paper describes a thermal solution for both heat removal as well as thermal isolation within a 3D chip stack. Based on the evaluated memory-logic 3D architecture and compared to conventional air-cooling, the proposed technologies reduce the maximum temperature of the memory die from 75.6 °C to 36.7 °C and processor die from 75.9 °C to 60.1 °C.

Keywords

air gaps; thermal management (packaging); three-dimensional integrated circuits; 3D chip stack; MEMS-logic stacks; air gap thermal isolation; heat removal; heterogeneous 3D IC; low-power dice; memory-logic 3D architecture; photonic-logic; thermal crosstalk; Bridges; Couplings; Heat sinks; Temperature sensors; Thermal resistance; Three-dimensional displays; Through-silicon vias; 3D IC; DRAM; TSVs; microbumps; microfluidic heat sink (MFHS); multicore processor;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2014 International

Type

conf

DOI

10.1109/3DIC.2014.7152174

Filename

7152174