• DocumentCode
    35975
  • Title

    Graphene-Based Heat Spreader for Flexible Electronic Devices

  • Author

    Sang-Hoon Bae ; Shabani, R. ; Jae-Bok Lee ; Seung-Jae Baeck ; Hyoung Jin Cho ; Jong-Hyun Ahn

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • Volume
    61
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    4171
  • Lastpage
    4175
  • Abstract
    Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.
  • Keywords
    chip scale packaging; cooling; flexible electronics; graphene devices; metallic thin films; thermal management (packaging); transparency; chip-on-film packaging; flexible electronic devices; graphene-based heat spreader; integrated circuit cooling; metal thin films; physical properties; thermal conductivity; thermal management; transparency; Conductivity; Flexible electronics; Graphene; Temperature measurement; Thermal conductivity; Thermal management; Chemical vapor deposition (CVD); chip-on-film; graphene; heat spreader; thermal conductivity; thermal conductivity.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2364606
  • Filename
    6952998