DocumentCode
3598195
Title
Defect etching of GaAs on Si
Author
Stirland, D.J.
Author_Institution
Plessey Res. Caswell Ltd., Allen Clark Res. Centre, Towcester, UK
fYear
1988
fDate
3/28/1988 12:00:00 AM
Firstpage
42522
Lastpage
42524
Abstract
A series of repeated etches of an identical area of bulk GaAs has been used to demonstrate the unusual action of the Wright etch. Emergent dislocations initially become etch pits, but at the same time a network of trails similar to those seen after A/B etching is also produced. Detailed TEM examinations of Wright etched GaAs epitaxial layers on Si have been examined as plan-view specimens by back-thinning. They demonstrate that the Wright etch can indeed produce etch pits at dislocation sites. The results also illustrate the problems involved in making direct comparisons between optical and TEM dislocation density determinations. Nevertheless, the author believes that the results will show that progress has been made towards this goal
Keywords
III-V semiconductors; etching; gallium arsenide; semiconductor epitaxial layers; transmission electron microscope examination of materials; vapour phase epitaxial growth; GaAs-Si; Si wafer; TEM dislocation density determinations; TEM examinations; VPE; Wright etch; Wright etched GaAs epitaxial layers on Si; back-thinning; defect etching; etch pits at dislocation sites; network of trails; optical dislocation density determination; plan-view specimens; series of repeated etches;
fLanguage
English
Publisher
iet
Conference_Titel
GaAs on Si, IEE Colloquium on
Type
conf
Filename
209037
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