DocumentCode
3598318
Title
Redundancy techniques for SRAM leakage reduction in presence of within-die delay variation
Author
Goudarzi, Maziar ; Ishihara, Tohru
Author_Institution
Syst. LSI Res. Center, Kyushu Univ., Fukuoka
Volume
1
fYear
2008
Abstract
Within-die variations are increasing with technology scaling, resulting in similarly designed SRAM cells show different delays at different parts of the same chip. We optimally choose higher threshold voltage (Vth) and/or gate-oxide thickness (Tox) for SRAM transistors so as to reduce leakage; consequently, cells delay increases, but due to within-die variation, only some (not all) of them violate original timing of the SRAM array, and hence, we can compensate them by adding reduncancies. In this paper we present two types of redundancy: spare cache ways for caches, and spare rows/columns for general SRAM arrays.
Keywords
SRAM chips; cache storage; redundancy; transistor circuits; SRAM leakage reduction; SRAM transistors; caches; gate-oxide thickness; redundancy techniques; threshold voltage; within-die delay variation; Decision support systems; Delay; Random access memory; Virtual reality; SRAM; cache; leakage; redundancy; variation;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference, 2008. ISOCC '08. International
Print_ISBN
978-1-4244-2598-3
Electronic_ISBN
978-1-4244-2599-0
Type
conf
DOI
10.1109/SOCDC.2008.4815605
Filename
4815605
Link To Document