DocumentCode :
3598583
Title :
Post-silicon validation challenges: How EDA and academia can help
Author :
Keshava, Jagannath ; Hakim, Nagib ; Prudvi, Chinna
Author_Institution :
M.S. SC12-214, Intel Corp., Santa Clara, CA, USA
fYear :
2010
Firstpage :
3
Lastpage :
7
Abstract :
The challenges of post-silicon validation are continuously increasing, driven by higher levels of integration, increased circuit complexity, and platform performance requirements. The pressure of maintaining aggressive launch schedules and containing an increased cost of validation and debug, require a holistic approach to the entire design and validation process. Post-silicon validation is very diverse, and the work starts well before first silicon is available-for example, emulation, design-for-validation (DFV) features, specialized content development, etc. This will require enhancing pre-tape out validation to have healthier first silicon, developing more standard interfaces to our validation hooks, developing more predictive tools for circuit and platform simulation and post-silicon debug, adding more formal coverage methods, and improving survivability to mitigate in-the-field issues. We view the Electronic Design Automation (EDA) industry as a key enabler to help us bridge the gaps between pre-silicon and post-silicon validation, and extend the considerable intellectual wealth in pre-silicon tools to the post-silicon validation area.
Keywords :
electronic design automation; EDA; academia; circuit complexity; design-for-validation features; electronic design automation; integration; platform performance requirements; post-silicon validation; specialized content development; Circuits; Complexity theory; Costs; Electronic design automation and methodology; Emulation; Job shop scheduling; Predictive models; Process design; Silicon; Standards development; Design; Emulation; Test; Validation; Verification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (DAC), 2010 47th ACM/IEEE
ISSN :
0738-100X
Print_ISBN :
978-1-4244-6677-1
Type :
conf
Filename :
5523430
Link To Document :
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