DocumentCode
3598758
Title
Best papers from ITherm 2002
fYear
2004
Keywords
Electronic packaging thermal management; Engineering management; Materials science and technology; Mechanical engineering; Production engineering; Soldering; Technology management; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1319143
Filename
1319143
Link To Document