• DocumentCode
    3598836
  • Title

    Low cost integrated photonic systems

  • Author

    Bostock, R.M. ; Townsend, J.E. ; Jones, R. ; Jansen, R.-J.E. ; Moore, D.F.

  • Author_Institution
    Cambridge Consultants Ltd., UK
  • Volume
    2
  • fYear
    1997
  • Firstpage
    274
  • Abstract
    Integrated optics will be more widely exploited when the integration of building blocks is low cost, versatile and reliable. Interconnection between active and passive components is a critical part of building such devices. We have developed a proprietary method for achieving fully passive alignment of optical fibres to other critical components using standard Si processing technologies. It is therefore stable for low cost high volume manufacture. High yields and excellent stability over a wide range of environmental conditions have been demonstrated
  • Keywords
    integrated circuit reliability; integrated circuit technology; integrated optoelectronics; optical fabrication; optical fibre couplers; optical interconnections; photolithography; surface mount technology; thermal stability; Si; active components; building blocks; fully passive alignment; high yields; integrated optics; low cost; low cost high volume manufacture; low cost integrated photonic systems; of environmental conditions; optical fibre connecting; optical fibres; passive components; reliable; standard Si processing technologies; Connectors; Costs; Manufacturing; Optical design; Optical fiber devices; Optical fiber testing; Optical polymers; Optical waveguides; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-3895-2
  • Type

    conf

  • DOI
    10.1109/LEOS.1997.645415
  • Filename
    645415