DocumentCode :
3598908
Title :
Distance learning - how to use this new didactic method in education of electronics engineering?
Author :
Illyefalvi-Vit?©z, Zsolt ; Gordon, Peter
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
Volume :
2
fYear :
2004
Firstpage :
1725
Abstract :
Distance learning (DL) is an instructional delivery system that connects learners with educational resources. In microelectronics and microsystems interconnection and packaging technology, the preparation of electronics engineers for the ever growing requirements is especially a challenge for today´s education, and there is an essential need for the application of advanced curricula and teaching methods. In the present paper, the driving forces for the development of curricula and didactic methods are outlined, followed by the detailed discussion of the needs for and the applicability of distance learning. Then, an example is provided for the application of the Internet-based performance centered instructions (IPCI) model for providing Web-based DL experiments in the special field of surface mounting technology (SMT) for students of electrical engineering and graduate engineers interested in microelectronics packaging and interconnection technology. Finally conclusions are drawn and further efforts are outlined.
Keywords :
distance learning; educational aids; educational courses; electronic engineering education; electronics packaging; information resources; interconnections; surface mount technology; IPCI model; Internet-based performance centered instructions; SMT; Web-based distance learning; curricula; didactic methods; distance learning; educational resources; electrical engineering; electronics engineering education; instructional delivery system; interconnection technology; microelectronics; microsystems; packaging technology; surface mounting technology; teaching methods; Computer aided instruction; Continuing education; Educational technology; Electronics packaging; Gold; Joining processes; Knowledge engineering; Microelectronics; Surface-mount technology; Web sites;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320351
Filename :
1320351
Link To Document :
بازگشت