DocumentCode :
35991
Title :
Fabrication of Thin Film Multijunction Thermal Converters With Improved Long-Term Stability
Author :
Fujiki, Hiroyuki ; Amagai, Yasutaka ; Shimizume, Koji ; Kishino, Kaname ; Hidaka, Shigeru
Author_Institution :
Nat. Metrol. Inst. of Japan, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
Volume :
64
Issue :
6
fYear :
2015
fDate :
Jun-15
Firstpage :
1754
Lastpage :
1759
Abstract :
To increase the long-term stability of thin-film multijunction thermal converters (TFMJTCs) developed by the National Metrology Institute of Japan and Nikkohm Corporation Ltd., we prevented their degradation by improving the design and fabrication process. Judging from the Arrhenius model experiments, we successfully increased the lifetime of a renewed TFMJTC to more than 20 years by improving the deposition pattern of a Bi-Sb-Cu-based thin-film thermopile. We also evaluated the thermoelectric effect of the renewed TFMJTCs by the fast-reversed dc method. The low thermoelectric effect of less than 0.1 μV/V has been realized, which is comparable with that of high-quality multijunction thermal converters previously produced by other national metrology institutes.
Keywords :
antimony; bismuth; circuit stability; convertors; copper; thermoelectricity; thermopiles; thin film devices; Arrhenius model; Bi-Sb-Cu; National Metrology Institute of Japan; Nikkohm Corporation Ltd.; TFMJTC; deposition pattern; fast-reversed DC method; long-term stability; thermoelectric effect; thin film multijunction thermal converter fabrication; thin-film thermopile; Electrical resistance measurement; Heating; Resistance; Standards; Temperature; Temperature measurement; Thermal stability; AC voltage standard; ac-dc transfer difference; ac???dc transfer difference; long-term stability; thermal converter; thermocouple; thin film; thin film.;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2015.2389371
Filename :
7021922
Link To Document :
بازگشت