DocumentCode
3600
Title
Parametric Macromodels for Efficient Design of Carbon Nanotube Interconnects
Author
Ferranti, Francesco ; Antonini, Giulio ; Dhaene, Tom ; Knockaert, Luc
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
Volume
56
Issue
6
fYear
2014
fDate
Dec. 2014
Firstpage
1674
Lastpage
1681
Abstract
The continuous increase of the operating frequency and density of integrated circuits leads to consider single-wall carbon nanotubes (SWCNTs) and multiwall carbon nanotubes (MWCNTs) as the most promising candidates for future interconnect technology because of their high current-carrying capacity and conductivity in the nanoscale, and immunity to electromigration. Several modeling methods for SWCNT and MWCNT interconnects have been based on the multiconductor transmission line (MTL) theory. These methods are limited to nanostructures with predefined values of electrical and geometrical parameters. Since process technology continues to scale downward and physical interconnect dimensions become smaller, the impact of design parameters (e.g., layout features) on the system behavior has to be carefully investigated for a successful design by performing design space exploration, optimization, and variability analysis. These design activities require multiple system simulations for different values of design parameters, and using MTL-based solvers is not an efficient choice. Parametric macromodels can be used to accurately and efficiently model these parameter effects, avoiding the brute-force use of MTL-based solvers.
Keywords
electromigration; integrated circuit interconnections; multi-wall carbon nanotubes; multiconductor transmission lines; single-wall carbon nanotubes; transmission line theory; MTL theory; MWCNT; SWCNT; carbon nanotube interconnects; current-carrying capacity; current-carrying conductivity; electromigration; integrated circuits; multiconductor transmission line theory; multiwall carbon nanotubes; parametric macromodels; single-wall carbon nanotubes; Frequency-domain analysis; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Numerical models; Time-domain analysis; Crosstalk; multiwall carbon nanotubes (MWCNTs); nanointerconnects; parametric macromodeling; single-wall carbon nanotubes (SWCNTs); transient analysis; transmission line modeling;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2014.2316243
Filename
6814879
Link To Document