• DocumentCode
    3600189
  • Title

    Defect Analysis over Multiple Release Versions of a Semiconductor Software System

  • Author

    Abuta, Eric ; Tian, Jeff

  • Author_Institution
    Verification & Validation Group, Verity Instrum., Inc., Carrollton, TX, USA
  • fYear
    2015
  • Firstpage
    55
  • Lastpage
    61
  • Abstract
    Demonstrating software reliability across multiple software revisions has become essential to end users of an end point detection system used in the semiconductor industry. This would enable them to make informed decisions of upgrading software versions without making significant impact to their current established processes. We show how one can use standard defect data normally collected in any software development organization to demonstrate reliability trends. We provide evidence of reliability maintained across the different versions and that continuous defect fixes increased software reliability over time.
  • Keywords
    electronic engineering computing; semiconductor industry; software reliability; continuous defect fixes; defect analysis; multiple release versions; reliability trends; semiconductor industry; semiconductor software system; software development organization; software reliability; software versions; Companies; Instruments; Market research; Production; Software; Software reliability; Analysis; Defects; Reliability; Semiconductor software; software versions and releases;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Complex Faults and Failures in Large Software Systems (COUFLESS), 2015 IEEE/ACM 1st International Workshop on
  • Type

    conf

  • DOI
    10.1109/COUFLESS.2015.16
  • Filename
    7181483