DocumentCode
3600189
Title
Defect Analysis over Multiple Release Versions of a Semiconductor Software System
Author
Abuta, Eric ; Tian, Jeff
Author_Institution
Verification & Validation Group, Verity Instrum., Inc., Carrollton, TX, USA
fYear
2015
Firstpage
55
Lastpage
61
Abstract
Demonstrating software reliability across multiple software revisions has become essential to end users of an end point detection system used in the semiconductor industry. This would enable them to make informed decisions of upgrading software versions without making significant impact to their current established processes. We show how one can use standard defect data normally collected in any software development organization to demonstrate reliability trends. We provide evidence of reliability maintained across the different versions and that continuous defect fixes increased software reliability over time.
Keywords
electronic engineering computing; semiconductor industry; software reliability; continuous defect fixes; defect analysis; multiple release versions; reliability trends; semiconductor industry; semiconductor software system; software development organization; software reliability; software versions; Companies; Instruments; Market research; Production; Software; Software reliability; Analysis; Defects; Reliability; Semiconductor software; software versions and releases;
fLanguage
English
Publisher
ieee
Conference_Titel
Complex Faults and Failures in Large Software Systems (COUFLESS), 2015 IEEE/ACM 1st International Workshop on
Type
conf
DOI
10.1109/COUFLESS.2015.16
Filename
7181483
Link To Document