• DocumentCode
    3600548
  • Title

    Evidence for Enhanced Reliability in a Novel Nanoscale Partially-Depleted SOI MOSFET

  • Author

    Anvarifard, Mohammad Kazem ; Orouji, Ali Asghar

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Semnan Univ., Semnan, Iran
  • Volume
    15
  • Issue
    4
  • fYear
    2015
  • Firstpage
    536
  • Lastpage
    542
  • Abstract
    This paper presents a new partially-depleted silicon-n-insulator (SOI) metal-oxide-semiconductor field effect transistor in order to improve the reliability successfully. An interfacial layer with the heavily doped n+ and p+ silicon is presented between the buried oxide and the source and channel regions. The presence of the interfacial layer causes the potential distribution modified inside the channel, and the minimum potential is pushed toward the interfacial layer, and therefore, the floating-body effect, which is one of important factors to characterize the reliability, is impressively reduced, and therefore, reliability of the proposed structure increases. Many main characteristics have been evaluated to compare the proposed structure performance with that of a conventional SOI. With regard to simulated transient, dc, and small-signal behaviors, the proposed structure shows marvelous performance improvement when compared with the conventional SOI.
  • Keywords
    MOSFET; heavily doped semiconductors; semiconductor device reliability; silicon; silicon-on-insulator; buried oxide; floating-body effect; heavily doped silicon; interfacial layer; nanoscale partially-depleted SOI MOSFET; reliability enhancement; silicon-on-insulator metal-oxide-semiconductor field effect transistor; small-signal behavior; Hysteresis; Logic gates; MOSFET; Reliability; Silicon; Threshold voltage; Transient analysis; Floating-body effect; SOI MOSFET; partially-depleted (PD);
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2014.2328583
  • Filename
    6825862