Title :
A 5.4-mW 180-cm Transmission Distance 2.5-Mb/s Advanced Techniques-Based Novel Intrabody Communication Receiver Analog Front End
Author :
Hao Wang ; Xian Tang ; Chiu Sing Choy ; Ka Nang Leung ; Kong Pang Pun
Author_Institution :
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong, China
Abstract :
This paper presents a low power, long-transmission distance, high data rate intrabody communication (IBC) analog receiver front end (RFE). First, to optimize the transmission performance, conventional transmission line analysis scheme is creatively adopted to the IBC design to characterize the body channel. Second, switched-capacitor filters based on sampling rate boosting technique are adopted for higher accuracy and lower power consumption. Third, a novel RFE topology is proposed to further enhance the IBC performance. The new RFE is designed and fabricated in a standard 180-nm CMOS process. Measurement results show that the RFE can successfully transmit data spanning the whole human body, around 180 cm, which is one of the longest transmission distances reported in related literatures. Furthermore, it reaches a maximum data rate of 2.5 Mb/s with a bit error rate less than 1e-7 and consumes 5.4 mW from a 1.8 V supply. The proposed RFE compares favorably to similar reported works.
Keywords :
CMOS integrated circuits; body area networks; error statistics; CMOS process; IBC; RFE; analog receiver front end; body channel; conventional transmission line analysis scheme; high data rate intrabody communication; long-transmission distance; novel RFE topology; novel intrabody communication receiver; receiver analog front end; sampling rate boosting technique; transmission performance; Attenuation; Boosting; Capacitors; Clocks; Impedance; Integrated circuit modeling; Receivers; Bit error rate (BER); intrabody communication (IBC); matching network; receiver front end (RFE); sampling rate boosting; switched-capacitor (SC) filter; transmission distance; transmission line (TL); transmission line (TL).;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2014.2379443