• DocumentCode
    3601451
  • Title

    Low-Leakage SRAM Wordline Drivers for the 28-nm UTBB FDSOI Technology

  • Author

    Corsonello, Pasquale ; Frustaci, Fabio ; Perri, Stefania

  • Author_Institution
    Univ. of Calabria, Cosenza, Italy
  • Volume
    23
  • Issue
    12
  • fYear
    2015
  • Firstpage
    3133
  • Lastpage
    3137
  • Abstract
    This brief deals with a new design of low-power SRAM wordline decoder in the 28-nm ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI) technology. The proposed approach synergistically adopts the poly biasing technique in conjunction with single-well/flip-well configurations and body biasing to opportunely tune the threshold voltage of the devices in the standby and active mode. A tuning methodology is described to optimize the static energy consumption. Post-layout simulations, done at power supply voltages ranging between 1 V and 0.5 V, have shown that, in comparison with the state-of-the-art techniques based on the same UTBB FDSOI technology, the proposed design achieves a maximum leakage up to 85% lower without paying significant delay penalties.
  • Keywords
    SRAM chips; low-power electronics; silicon-on-insulator; UTBB FDSOI technology; body biasing technique; fully depleted silicon-on-insulator; low leakage SRAM wordline driver; low power SRAM wordline decoder; poly biasing technique; single-well-flip-well configurations; size 28 nm; threshold voltage tuning; ultrathin body SOI; voltage 0.5 V; voltage 1 V; Delays; Inverters; Leakage currents; MOS devices; Random access memory; Transistors; Very large scale integration; Body biasing; SRAM peripheral; leakage optimization; poly biasing; ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI); ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI).;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2014.2384007
  • Filename
    7050376