DocumentCode
3601451
Title
Low-Leakage SRAM Wordline Drivers for the 28-nm UTBB FDSOI Technology
Author
Corsonello, Pasquale ; Frustaci, Fabio ; Perri, Stefania
Author_Institution
Univ. of Calabria, Cosenza, Italy
Volume
23
Issue
12
fYear
2015
Firstpage
3133
Lastpage
3137
Abstract
This brief deals with a new design of low-power SRAM wordline decoder in the 28-nm ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI) technology. The proposed approach synergistically adopts the poly biasing technique in conjunction with single-well/flip-well configurations and body biasing to opportunely tune the threshold voltage of the devices in the standby and active mode. A tuning methodology is described to optimize the static energy consumption. Post-layout simulations, done at power supply voltages ranging between 1 V and 0.5 V, have shown that, in comparison with the state-of-the-art techniques based on the same UTBB FDSOI technology, the proposed design achieves a maximum leakage up to 85% lower without paying significant delay penalties.
Keywords
SRAM chips; low-power electronics; silicon-on-insulator; UTBB FDSOI technology; body biasing technique; fully depleted silicon-on-insulator; low leakage SRAM wordline driver; low power SRAM wordline decoder; poly biasing technique; single-well-flip-well configurations; size 28 nm; threshold voltage tuning; ultrathin body SOI; voltage 0.5 V; voltage 1 V; Delays; Inverters; Leakage currents; MOS devices; Random access memory; Transistors; Very large scale integration; Body biasing; SRAM peripheral; leakage optimization; poly biasing; ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI); ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI).;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2014.2384007
Filename
7050376
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