DocumentCode
3601489
Title
Sensor Placement for Fault Isolability Based on Bond Graphs
Author
Guoyi Chi ; Danwei Wang
Author_Institution
Centre for E-City, Nanyang Technol. Univ., Singapore, Singapore
Volume
60
Issue
11
fYear
2015
Firstpage
3041
Lastpage
3046
Abstract
This technical note proposes a novel sensor placement approach based on the bond graph (BG) for isolability. It is investigated in the linear differential-algebraic equations model regarding a BG. Causal paths are employed to capture the cause-effect relationships of model equations. The case study shows that this novel approach is independent of causality assignment on BGs and performs well.
Keywords
bond graphs; causality; cause-effect analysis; differential algebraic equations; fault diagnosis; linear differential equations; bond graph; causal path; causality assignment; cause-effect relationship; fault isolability; linear differential-algebraic equations model; model equation; sensor placement approach; Circuit faults; Computational modeling; Equations; Integrated circuit modeling; Junctions; Mathematical model; Vectors; Bond graph (BG); fault detection and isolation (FDI);
fLanguage
English
Journal_Title
Automatic Control, IEEE Transactions on
Publisher
ieee
ISSN
0018-9286
Type
jour
DOI
10.1109/TAC.2015.2409952
Filename
7054462
Link To Document